MediaTek Helio X23 and X27 feature MediaTek Tri-Cluster Deca-core architecture (2x ARM Cortex-A72 + 4x ARM Cortex-A53 + 4x ARM Cortex-A53) and MediaTek CorePilot 3.0 technology. Both these have ARM Mali T880 MP4 GPU and support up to 4GB 2x LPDDR3 800MHz RAM.
“The MediaTek Helio platform fulfills the diverse needs of device makers. Based on the success of MediaTek Helio X20 and X25, we are introducing the upgraded MediaTek Helio X23 and X27. The new SoCs support premium dual camera photography and provide best in-class performance and power consumption,” said Jeffrey Ju, Executive Vice President and Co-Chief Operating Officer at MediaTek.
These also include MiraVision EnergySmart Screen power-saving technology that effectively modifies the smart display parameters based on the on-screen content and ambient lighting for up to a 25% reduction in display power consumption. Combined, these features give users the best visual experience possible. These have Envelope Tracking Module that provides further power-efficiency by dynamically adjusts the output voltage based on signal strength from the power amplifier, averaging a 15% reduction in power consumption during peak output.
Smartphones powered by MediaTek Helio X23 and X27 will be available soon.
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