MediaTek Helio X23 and X27 feature MediaTek Tri-Cluster Deca-core architecture (2x ARM Cortex-A72 + 4x ARM Cortex-A53 + 4x ARM Cortex-A53) and MediaTek CorePilot 3.0 technology. Both these have ARM Mali T880 MP4 GPU and support up to 4GB 2x LPDDR3 800MHz RAM.
“The MediaTek Helio platform fulfills the diverse needs of device makers. Based on the success of MediaTek Helio X20 and X25, we are introducing the upgraded MediaTek Helio X23 and X27. The new SoCs support premium dual camera photography and provide best in-class performance and power consumption,” said Jeffrey Ju, Executive Vice President and Co-Chief Operating Officer at MediaTek.
Dual camera photography has become the standard for high-end smartphones. MediaTek Helio X23 and X27 fully support dual camera photography with the upgraded MediaTek Imagiq image signal-processing solution. The MediaTek Imagiq ISP is the first to integrate color and mono cameras and depth-of-field applications into a single ISP aimed at both quality and functionality for photography. MediaTek Helio X23 and X27 boast significant improvements in image clarity, saturation, exposure control, portrait performance, and large aperture applications optimized through the color+mono smart dual camera and dual phase-detection systems.
These also include MiraVision EnergySmart Screen power-saving technology that effectively modifies the smart display parameters based on the on-screen content and ambient lighting for up to a 25% reduction in display power consumption. Combined, these features give users the best visual experience possible. These have Envelope Tracking Module that provides further power-efficiency by dynamically adjusts the output voltage based on signal strength from the power amplifier, averaging a 15% reduction in power consumption during peak output.
Smartphones powered by MediaTek Helio X23 and X27 will be available soon.
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