It uses TSMC’s latest 7nm plus EUV manufacturing, which helps enable a smaller die size offering 36% board reduction, increased transistor density by 18% and 10% improvement in energy efficiency. These have 16-Core Mali-G76 GPU, compared to 10-Core in the Kirin 980 SoC offering 6% improvement in graphics processing performance.
The built-in 5G modem in the Kirin 990 5G offers up to 2.3Gbps download speed and 1.25 Gbps upload speed. Combined with LTE, this will offer up to 3.3Gbps download speed and up to 1.32Gbps upload speed. The SoCs have 2 (Big Core) performance + 1 (Smaller Core) ultra lower consumption Da Vinci-based NPU.
Kirin 990 5G adopts new ISP 5.0, the throughput rate is increased by 15%, the energy efficiency is increased by 15%, the video processing capability is improved. It also adopts block-matching and 3D filtering (BM3D) professional-level hardware noise reduction (NR) for capturing brighter and sharper images in low light environments. It is also the first to use dual-domain video NR for more accurate noise processing for videos.
- Kirin 990 5G — Up to 2.86GHz dual-core ARM Cortex A76 CPU + up to 2.36 GHz dual-core ARM Cortex A76 CPU + up to 1.95GHz ARM Cortex A55 GPU
- Kirin 990 — Up to 2.86GHz dual-core ARM Cortex A76 CPU + up to 2.09 GHz dual-core ARM Cortex A76 CPU + up to 1.86GHz ARM Cortex A55 GPU
- 700MHz ARM Mali-G76MP16 GPU
- TSMC 7nm process for Kirin 990 / TSMC’s 7FF+ with EUV for Kirin 990 5G
- LPDDR4X memory, UFS 3.0 and UFS 2.1 storage
- 2 + 1 Da Vinci NPU
- Video: HDR10; 4K at 60fps decoding, 4K at 30fps encoding
- Security Engine
- Integrated Multi-mode 4G LTE Modem for Kirin 990 and 5G modem for Kirin 990 5G
Huawei Kirin 990 and Kirin 990 5G SoCs will power the Mate 30 series that will be announced at an event in Germany on September 19.
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