Sony is all set to launch Phones at MWC 2018. Now Upcoming Sony Phone with Snapdragon 845, 18:9 Display Model number Sony H8266 has been leaked on AnTuTu.
Sony will unveil new devices at MWC 2018 on February 26
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According to AnTuTu listing, Sony H8266 to come with 18:9 Display with 2160×1080 pixel Powered by Snapdragon 845 with Adreno 630 GPU. It has a 4GB RAM and 64GB internal storage runs on Android 8.0 Oreo.
According to earlier leaks, Sony H8266 will be Water Resistant (IP65/IP68).Phone measures 157 × 78× 8.1 mm, Weight: 159g. It will have a 3210/3240mAh battery with Qnovo Adaptive Charging
Sony will unveil new devices at MWC 2018 on February 26
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